SolidRun Launches the Compact HoneyComb Ryzen V3000 Development Platform
Eight cores, 16 threads, and plenty of PCIe lanes if you need an accelerator for good measure: this HoneyComb is a real sweet treat.
Embedded computing specialist SolidRun has launched a compact mini-ITX-format machine designed for high-performance industrial and edge artificial intelligence (edge AI) workloads, powered by AMD's Ryzen Embedded V3C18I: the HoneyComb Ryzen V3000 Development Platform.
"The HoneyComb Ryzen V3000 development platform reinforces our commitment to delivering scalable, powerful, and customizable solutions that empower our customers to rapidly develop innovative industrial and enterprise solutions," claims SolidRun's chief executive officer Atai Ziv, PhD, of the company's latest launch. "Its robust design and flexible architecture provide the perfect foundation for industries transitioning to higher-performance edge and networking applications."
The HoneyComb isn't a single-board computer, but a mini-ITX carrier board for a COM Express 7 (CEX7) computer-on-module (COM) built around AMD's Ryzen Embedded V3C18I system-on-chip — featuring eight processor cores and 16 threads running at a 1.9GHz base clock and boosting up to 3.8GHz. There's 64GB of on-board DDR5 memory, and up to 20 lanes of PCI Express Gen. 4 connectivity shared between an open-ended 8x-mechanical PCIe slot and an M.2 slot — ideal, the company says, for adding additional accelerators for more demanding workloads.
Elsewhere on the board are a pair of 10-gigabit-Ethernet SFP+ ports plus a single 2.5-gigabit-Ethernet RJ45 port, two SATA 3.0 ports, USB 2.0 and USB 3.2 connectivity for peripherals, a header for general-purpose input/output (GPIO), I2C, and SMBUS connectivity, and a UART bus for debugging. There's also standard ATX power supply connectivity, but the system itself is surprisingly lightweight for its promised performance: SolidRun says the COM can be configured to run from a 15W to 45W thermal design profile (TDP) envelope, and can operate in ambient temperatures from -40°C to 85°C (-40°F to 195°F) when used with the bundled heatsink and fan assembly.
"Our HoneyComb Ryzen V3000 provides exceptional flexibility, enabling customers to develop, test and rapidly deploy high-performance embedded systems customized specifically for their needs," boasts SolidRun's chief system architect Jon Nettleton. "With dual 10Gb Ethernet, extensive PCIe expansion, and exceptional power efficiency, this platform perfectly serves demanding edge applications, from AI acceleration to software-defined networking and beyond."
The HoneyComb Ryzen V3000 Development Platform is now available on the SolidRun website, priced at $1,000.