Co-Making the Future

2016 China-US Young Maker Competition

This competition is over! Want more chances to win prizes? Check out our active contests.

Competition status

Prizes awarded

Prizes

US Semi-Finalists
Three dimensional beijing skyline city silhouette artwork 36250650

Win an all-expense paid trip to Beijing for the final competition along with other amazing makers!

Timeline

Project submissions open:

April 25, 2016 at 8:00 AM PT

Deadline to apply for free kits:

June 24, 2016 at 5:59 PM PT

Project submissions close:

June 24, 2016 at 5:59 PM PT

Semi-Finalists announced by:

July 10, 2016

Competition brief

 

 

 

Are you a U.S. based maker? Do you have ideas and skills that can change the world? If so, join our competition and build innovative projects that solve real world problems. Compete against makers and tinkerers from China and become the ultimate global maker. Ready to start? Submit your project for a chance to travel to Beijing, China! 

 

Competition Timeline:

                            

 

  • Stage 1: Submit your project on this contest page by June 17th.
  • Stage 2: Judging begins June 18th, with semi-finalists announced by July 1st. 
  • Stage 3: Final competition will be held in Beijing, August 14th to August 19th.

 

Guidelines for creating your project:  

 

 

 

Innovation and Creativity: Is the product innovative and creative?
40 Points
 
 
 
 
Application Prospects: Does the product have application prospects? 
20 Points
 
 
 
 

 

Integrality: Is the product integral and user-friendly?
40 Points
 
 

How to Submit your Idea:

  1. Must be a legal resident of the United States
  2. Create a free Hackster.io account.
  3. Register to participate in this contest by clicking "Register as a Participant".
  4. Start by entering a 3 minute video submission in the project template.
  5. Finish by submitting a complete project, click "Submit my final entry."

Make sure you include the following:

  • Video, images and story
  • Schematics and sourcecode
  • BOM and CAD files 
  • Get inspired by this sample project

 

 10 lucky semi-finalists will fly to Beijing China to compete in the global competition with a chance to win the following prizes: First prize: approximately $15,000 USD. Second prize: approximately $8,000 USD. Third prize: approximately $5,000 USD. 

 

Need hardware to complete your submission? We are giving away a limited number of Intel® Edison™ Developer Kits. Get yours by submitting your application by June 17, 2016 which we will review on a first come, first served basis. One device maximum per team, while supplies last.

 

 Thank you sponsors for making this happen!

 

                 

 

                   

      

 

 

 

Competition rules

Full rules

Co-making the Future

A China-US Young Maker Competition

Download The Official Rules

ProjectsCommunitiesTopicsContestsLiveAppsBetaFree StoreBlogAdd projectSign up / Login
Feedback